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Technology: Semiconductor Packaging

Technical Achievements

  • First polymer to pass MIL 883B qualification for 20 year life applications
  • Direct hermetic sealing and bonding
  • Tailored isotropic coefficient of thermal expansion (CTE), dielectric constant (Dk), and loss tangent (Tan δ)
  • High temperature resistance (>320 C)

Industry Partners

Freescale Semiconductor