Request More Information

White Paper Abstract

Multi-lead Organic Air-Cavity Package for High Power High Frequency RFICs (2009)
Presented at IEEE International Microwave Symposium, June 7-12, 2009, Boston, MA, USA.

A new air cavity package has been developed and qualified for packaging high power RF components. The package uses the standard outline of a conventional ceramic package. The ceramic dielectric is replaced with a novel high performance thermoplastic which is a modified liquid crystal polymer. The package manufacturing technology provides for a cost effective means of creating a package with multiple leads. Such package is advantageous in the cellular base station market for high electrical and thermal performance, reliability and lower system level cost using a power RFIC. This paper outlines the construction of the package and the reliability test findings collected for an 18-leaded version of the package.