Semiconductor Packaging
- LDMOS Power Amplifier
- Air Cavity QFN
- Custom Packaging
- RF & Microwave
- Custom Military
- World’s only hermetic plastic package
Films / Laminates
- High Frequency
- Up to 100Ghz
- Modules
- Circuit Boards
- Thermal Substrates
- Adjustable Dk
Over-molded Materials
- Sensors
- Industrial
- Automotive
- Military
- Consumer
- Stress Reduction
Semiconductor wafer processing
- Semiconductor component processing
- High-temperature processing
- Isotropic shrinkage
Structural Plastics
- Consumer Products
- High Modulus
- High Elongation
- Isotropic
- Low Shrinkage
- RF Transparent
Automotive
- Structural Materials for weight reduction
- Metal replacement
- Low warpage
- Low moisture
- Match CTE of metals
Low Dk Materials
- Injection molded low Dk materials
- High Frequency Connectors
- Dk < 3.0
- Df = 0.0007
- Insertion loss better than LTCC
LCP Film Battery Pouch
- Reduces thickness 50%, higher power density
- Thermally Conductive reduce “time to failure”
- Better thermo-formability, more flexible
- Lower Cost than Aluminum Laminate
- No corrosion resistance pre-conditioning
- Eliminate GSM signal interference from battery
LCP for 4G and 5G Antenna Applications
- High Speed
- Stable Dielectric constant
- Low loss tangent
- Low thermal expansion
- Higher frequency Range
- Higher Data transmission rates
- Greater data capacity
- Improved frequency attenuation
- Improved Moisture resistance
- Superior Thermal performance
- Thinner – less space
- Low-latency data transfer