Our Markets

Semiconductor Packaging

  • LDMOS Power Amplifier
  • Air Cavity QFN
  • Custom Packaging
  • RF & Microwave
  • Custom Military
  • World’s only hermetic plastic package

Films / Laminates

  • High Frequency
  • Up to 100Ghz
  • Modules
  • Circuit Boards
  • Thermal Substrates
  • Adjustable Dk

Over-molded Materials

  • Sensors
  • Industrial
  • Automotive
  • Military
  • Consumer
  • Stress Reduction

Semiconductor wafer processing

  • Semiconductor component processing
  • High-temperature processing
  • Isotropic shrinkage

Structural Plastics

  • Consumer Products
  • High Modulus
  • High Elongation
  • Isotropic
  • Low Shrinkage
  • RF Transparent

Automotive

  • Structural Materials for weight reduction
  • Metal replacement
  • Low warpage
  • Low moisture
  • Match CTE of metals

Low Dk Materials

  • Injection molded low Dk materials
  • High Frequency Connectors
  • Dk < 3.0
  • Df = 0.0007
  • Insertion loss better than LTCC

LCP Film Battery Pouch

  • Reduces thickness 50%, higher power density
  • Thermally Conductive reduce “time to failure”
  • Better thermo-formability, more flexible
  • Lower Cost than Aluminum Laminate
  • No corrosion resistance pre-conditioning
  • Eliminate GSM signal interference from battery

LCP for 4G and 5G Antenna Applications

  • High Speed
  • Stable Dielectric constant
  • Low loss tangent
  • Low thermal expansion
  • Higher frequency Range
  • Higher Data transmission rates
  • Greater data capacity
  • Improved frequency attenuation
  • Improved Moisture resistance
  • Superior Thermal performance
  • Thinner – less space
  • Low-latency data transfer