Our tailored LCP formulations deliver world class properties.
Chemical
- Chemical resistance
- Ultra low moisture absorption
- Low O2 and CO2 transmission
- Corrosion resistance
Mechanical
- Higher tensile strength and elastic modulus
- High strength-to-weight ratio
- Adhesion to metals
- Dimension stability across wide temperature ranges
Thermal
- High thermal resistance
- Tailored CTE matching to metals
- Low melt viscosity
- Stable and linear
- Isotropic
Electrical/ Optical
- Low dielectric constant & Low loss tangent
- Electrical Stability over wide temperature range
- Up to 60GHz performance
iQLP enhances LCP properties through Material Science and Processing Technology
Materials Science
Polymerization & innovative formulations with unique resin-filler technology tailors:
- Elastic modulus
- Coefficient of Thermal Expansion & Isotropy
- Dielectric Constant & Isotropy
- Chemical and moisture barrier properties
Processing Technology
- Process techniques and material modifications enable extrusion/injection molding of difficult material blends and complex shapes
- Innovative high volume manufacturing film process
- Expert mold design and injection molding
Features
Electrical
- Tailored range of dielectric properties (Dk), 2.5 – 4.0
- Enables design flexibility, lower signal loss, smaller form factor
Mechanical
- Elastic Modulus from 4 to 19 GPa
- Elongation up to 9%
- iQLP Isotropy ~ 1.0 vs. traditional LCP anisotropy ~ 0.2
Thermal
- Coefficient of Thermal Expansion (CTE) matching metals and minimizing stress
- High Thermal resistance
- Dimensionally stable and linear over wide temperature range
- Low melt viscosity for complex, thin wall molding
Chemical and Barrier
- Ultra low moisture absorption
- Low O2, and CO2 transm.
- Corrosion resistance
- 50% improved barrier properties (WVTR) vs. standard LCP